| Insulation Materials: | Epoxy Resin |
|---|---|
| Flame Retardant Properties: | V0 |
| Application: | Consumer Electronics |
| Special Process: | Stiffeners etc |
| Holes Specification: | Buried/Blind Vias, Via in Pads, Counter Sink Hole |
| Copper Thickness: | 0.5-8oz |
| Samples: |
|---|
| Customization: |
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