| Structure: | Multilayer FPC |
|---|---|
| Material: | Fr4, Cem1, Cem3 Aluminum HDI |
| Combination Mode: | Adhesive Flexible Plate |
| Application: | Consumer Electronics, Electronics Device |
| Conductive Adhesive: | Anisotropic Conductive Adhesive |
| Flame Retardant Properties: | V0 |
| Samples: |
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| Customization: |
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