Customization: | Available |
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Structure: | Multilayer FPC |
Material: | Polyimide |
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Technical & Capability
Item |
Speci. |
Layers |
1~8 |
Board Thickness |
0.1mm-0.2mm |
Substrate Material |
PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) |
Conductive Medium |
Copper foil(1/3oz,1/2oz,1oz,2oz) Constantan Silver Paste Copper Ink |
Max Panel Size |
600mm×1200mm |
Min Hole Size |
0.1mm |
Min Line Width/Space |
3mil(0.075mm) |
Maximum imposition size (single & double panel)
|
610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples) |
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid)
|
610*1650mm |
Drilling Hole (Mechanical) |
17um--175um |
Finish Hole (Mechanical) |
0.10mm--6.30mm |
Diameter Tolerance (Mechanical) |
0.05mm |
Registration (Mechanical) |
0.075mm |
Aspect Ratio |
2:1(Minimum aperture 0.1mm) 5:1(Minimum aperture 0.2mm) 8:1(Minimum aperture 0.3mm) |
SMT Mini. Solder Mask Width |
0.075mm |
Mini. Solder Mask Clearance |
0.05mm |
Impedance Control Tolerance |
+/-10% |
Surface finish |
ENIG, HASL, Chem. Tin/Sn |
Soldermask/Protective Film |
PI(0.5mil,1mil,2mil)(Yellow, White, Black) PET(1mil,2mil) Solder mask (green, yellow, black...) |
Silkscreen |
Red/Yellow/Black/White |
Certificate |
UL, ISO 9001, ISO14001, IATF16949 |
Special Request |
Glue(3M467,3M468,3M9077,TESA8853...) |
Material Suppliers |
Shengyi, ITEQ, Taiyo, etc. |
Common Package |
Vacuum+Carton |
Monthly production capacity/m² |
60,000 m² |
Production capacity of hot-sale products | |
Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
Technical Capability | Technical Capability |
Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Aluminum base, Copper base |
Layer: 1 layer to 20 Layers | Layer: 1 layer and 2 Layers |
Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
Min.Hole size: 0.1mm(dirilling hole) | Min. Hole size: 12mil(0.3mm) |
Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etc |
Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
Category | Quickest Lead Time | Normal Lead Time |
Double-sided | 24hrs | 120hrs |
4 Layers | 48hrs | 172hrs |
6 Layers | 72hrs | 192hrs |
8 Layers | 96hrs | 212hrs |
10 Layers | 120hrs | 268hrs |
12 Layers | 120hrs | 280hrs |
14 Layers | 144hrs | 292hrs |
16-20 Layers | Depends on the specific requirements | |
Above 20 Layers | Depends on the specific requirements |