| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
|
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|
Item |
Speci. |
|
Layers |
1~20 |
|
Board Thickness |
0.1mm-8.0mm |
|
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc |
|
Max Panel Size |
600mm×1200mm |
|
Min Hole Size |
0.1mm |
|
Min Line Width/Space |
3mil(0.075mm) |
|
Board Outline Tolerance |
+/-0.10mm |
|
Insulation Layer Thickness |
0.075mm--5.00mm |
|
Out Layer Copper Thickness |
18um--350um |
|
Drilling Hole (Mechanical) |
17um--175um |
|
Finish Hole (Mechanical) |
0.10mm--6.30mm |
|
Diameter Tolerance (Mechanical) |
0.05mm |
|
Registration (Mechanical) |
0.075mm |
|
Aspect Ratio |
16:1 |
|
Solder Mask Type |
LPI |
|
SMT Mini. Solder Mask Width |
0.075mm |
|
Mini. Solder Mask Clearance |
0.05mm |
|
Plug Hole Diameter |
0.25mm--0.60mm |
|
Impedance Control Tolerance |
+/-10% |
|
Surface finish |
ENIG, OSP, HASL, Chem. Tin/Sn, Flash Gold |
|
Soldermask |
Green/Yellow/Black/White/Red/Blue |
|
Silkscreen |
Red/Yellow/Black/White |
|
Certificate |
UL, ISO 9001, ISO14001, IATF16949 |
|
Special Request |
Blind hole, Gold finger, BGA, Carbon ink, peekable mask, VIP process, Edge plating, Half holes |
|
Material Suppliers |
Shengyi, ITEQ, Taiyo, etc. |
|
Common Package |
Vacuum+Carton |
| Production capacity of hot-sale products | |
| Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
| Technical Capability | Technical Capability |
| Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Aluminum base, Copper base |
| Layer: 1 layer to 20 Layers | Layer: 1 layer and 2 Layers |
| Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole size: 0.1mm(dirilling hole) | Min.Hole Size: 12mil(0.3mm) |
| Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
| Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
| Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
| NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
| Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
| Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, etc |
| Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
| Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
| Category | Quickest Lead Time | Normal Lead Time |
| Double-sided | 24hrs | 120hrs |
| 4 Layers | 48hrs | 172hrs |
| 6 Layers | 72hrs | 192hrs |
| 8 Layers | 96hrs | 212hrs |
| 10 Layers | 120hrs | 268hrs |
| 12 Layers | 120hrs | 280hrs |
| 14 Layers | 144hrs | 292hrs |
| 16-20 Layers | Depends on the specific requirements | |
| Above 20 Layers | Depends on the specific requirements | |
How ABIS Working Out the Manufacturing Issues in FR4 PCB?
-Hole Preparation
Removing debris carefully & adjusting drill machine parameters: before plating through with copper, Abis pays high attention to all holes on an fr4 PCB treated to remove debris, surface irregularities, and epoxy smear, the clean holes ensure the plating successfully adheres to the hole walls. also, early in the process, drill machine parameters are adjusted accurately.
- Surface Preparation
Deburring carefully: our experienced tech workers will be aware ahead of time that the only way to avoid a bad outcome is to anticipate the need for special handling and to take the appropriate steps to be sure that the process is done carefully and correctly.
-Thermal Expansion Rates
Accustomed to dealing with the various materials, Abis will be able to analyze the combination to be sure that it is appropriate. then keeping the long-term reliability of the CTE (coefficient of thermal expansion), with the lower case, the less likely the plated through holes are to fail from repeated flexing of the copper which forms the internal layer interconnections.
-Scaling
Abis control the circuitry is scaled up by known percentages in anticipation of this loss so that the layers will return to their as-designed dimensions after the lamination cycle is complete. also, using the laminate manufacturer's baseline scaling recommendations in combination with in-house statistical process control data, to dial-in scale factors that will be consistent over time within that particular manufacturing environment.
-Machining
When the time comes to build your PCB, Abis be sure that you choose to have the right equipment and experience to produce it correctly on the first try.
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