Customization: | Available |
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Structure: | Multilayer FPC |
Material: | Polyimide |
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ABIS Flexible PCB Manufacturing Capacity
Item |
Speci. |
Layers |
1~8 |
Board Thickness |
0.1mm-0.2mm |
Substrate Material |
PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) |
Conductive Medium |
Copper foil(1/3oz,1/2oz,1oz,2oz) Constantan Silver Paste Copper Ink |
Max Panel Size |
600mm×1200mm |
Min Hole Size |
0.1mm |
Min Line Width/Space |
3mil(0.075mm) |
Maximum imposition size (single & double panel)
|
610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples) |
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid)
|
610*1650mm |
Drilling Hole (Mechanical) |
17um--175um |
Finish Hole (Mechanical) |
0.10mm--6.30mm |
Diameter Tolerance (Mechanical) |
0.05mm |
Registration (Mechanical) |
0.075mm |
Aspect Ratio |
2:1(Minimum aperture 0.1mm) 5:1(Minimum aperture 0.2mm) 8:1(Minimum aperture 0.3mm) |
SMT Mini. Solder Mask Width |
0.075mm |
Mini. Solder Mask Clearance |
0.05mm |
Impedance Control Tolerance |
+-0% |
Surface finish |
ENIG, HASL, Chem. Tin/Sn |
Soldermask/Protective Film |
PI(0.5mil,1mil,2mil)(Yellow, White, Black) PET(1mil,2mil) Solder mask (green, yellow, black...) |
Silkscreen |
Red/Yellow/Black/White |
Certificate |
UL, ISO 9001, ISO14001, IATF16949 |
Special Request |
Glue(3M467,3M468,3M9077,TESA8853...) |
Material Suppilers |
Shengyi, ITEQ, Taiyo, etc. |
Common Package |
Vacuum+Carton |
Monthly production capacity/m² |
60,000 m² |
ABIS Flexible PCB Manufacturing Process
-Double-side Flex-PCB:
Cutting → Drilling → PTH → Electroless Plating → Pretreating → Dry Film Lamination → Position → Exposure → Develop → Pattern Plating → Remove Dry Film → Pretreating → Dry Film Lamination → Position and Exposure → Develop → Etching → Remove Dry Film → Surface Finish → Cover lay Lamination → Lamination → Curing → Immersion Gold → Silkscreen → V-cutting/scoring → Electrical Test → Punching → FQC → Packaging → Shipment
-Single-side Flex-PCB:
Cutting → Drilling → Dry Film Lamination → Position and Exposure → Develop → Etching → Remove Dry Film → Surface Finish → Coverlay Lamination →Lamination → Curing → Surface Finish → Immersion Gold → Silkscreen → V-cutting/scoring → Electrical Test → Punching → FQC → Packaging → Shipment
Flexible PCB Lead Time
Small Batch Volum ≤1 sq meter |
Working Days |
Mass Production |
Working Days |
Single-Sided |
3-4 |
Single-Sided |
8-10 |
2-4 layers |
4-5 |
2-4 layers |
10-12 |
6-8 layers |
10-12 |
6-8 layers |
14-18 |
How ABIS Dealing With Flexible PCB Issues?
The first thing we ensure is the right equipment to produce your board. Next, the staff experienced enough to handle the challenge of manufacturing flexible boards.
Our Advantages
Quality Control
-Advanced equipment list
AOI Testing |
Checks for solder paste Checks for components down to 0201 Checks for missing components, offset, incorrect parts, polarity |
X-Ray Inspection |
X-Ray provides high-resolution inspection of: BGAs/Micro BGAs/Chip scale packages /Bare boards |
In-Circuit Testing | In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. |
Power-up Test |
Advanced Function Test
Flash Device Programming
Functional testing
|
-Persue 0% complaint on quality
Pre-Sale and After-Sale Service
WELCOME TO ABIS CIRCUITS CO., LTD
Production line
ABIS GROUP is a professional PCB manufacturing which is focused on double side, Multilayer and HDI PCB mass production. The company was established in 2006, We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Huizhou is for big volume and HDI.
Shenzhen | jiangxi | |
Area | 10,000 Square meters | 60000 Square meters |
Employees | 300 | 900 |
Quality | 20 | 60 |
Administration |
5 | 10 |
Engnieering | 20 | 90 |
Over Sales |
10 | 20 |
Item | Capacity |
Raw material | Aluminum base, Cooper base |
Layer | 1-8 Layer |
Min.Line width/space | 4mil/4mil(0.1mm/0.1mm) |
Min.hole size | 12mil(0.3mm) |
Max. Board size | 1200mm*560mm(47in*22in) |
Finished board thickness | 0.3-5mm |
Cooper foil thickness | 35um-210um(1OZ-6OZ) |
Remain thickness tolerance | +/-0.1mm |
Hole position tolerance | +/-0.05mm |
Routing outline tolerance | +/-0.15mm |
Punching outline tolerance | +/-0.1mm |
Surface finished | Lead-free HASL, Immersion gold, immersion silver, OSP, etc |
MC PCB Production capability | 10,000 a.q.m/month |
Item | Capacity |
Raw material | CEM1, CEM3, FR1 FR4, Rogers, Teflon, etc. |
Layer | 1 Layer-20 Layer |
Min.Line width/space | 3mil/ 3mil (0.075mm/0.075mm) |
Min.hole size | 0.1mm(drilling hole) |
Max. Board size | 1200mm* 600mm |
Finished board thickness | 0.2mm-6.0mm |
Cooper foil thickness | 18um- 280um (0.5oz-8oz) |
NPTH Hole Tolerance | +/- 0.075mm |
PTH hole Tolerance | +/-0.05mm |
Outline tolerance | +/-0.13mm |
Surface finished | Lead-Free HASL, immersion gold(ENIG), Immersion silver, OSP, gold plating, gold finger, Carbon INK |
Impedance Control Tolerance | +/-10% |
Production capability | 50,000 s.q.m/ month |
ABIS CIRCUITS Company is not only trying to give customers a good product, but also pay attention to offering a complete and safe package. Also, we prepare some personalized services for all the orders.
-Common packaging:
-Delivery Tips:
Business Terms
-Accepted Delivery Terms
FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF
--Accepted Payment Currency
USD, EUR, CNY.
-Accepted Payment Type
T/T, PayPal, Western Union.
Quotation from ABIS
To ensure an accurate quote, be sure to include the following information for your project:
FAQ