Customization: | Available |
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Structure: | Multilayer FPC |
Material: | Polyimide |
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TECHNICAL PARAMETER
Layer | 1-20 layers |
Material | FR-4,CEM-1,Aluminum base,Copper base,FR-1,CEM-3,High TG,FR4 Halogen Free, Rogers, TEFLON etc. |
Board thickness | 0.2mm-6mm(normally 1.6mm) |
Max. board size | 1200*600mm |
Finished board thickness | 0.3-5mm |
Min .drilled hole size | 0.1mm |
Min. line width | 0.1mm(4mil) |
Min. line space | 0.1mm(4mil) |
Surface finish/treatment | HASL, lead free HASL ,Immersion Gold(ENIG),Immersion Tin ,Immersion Silver, OSP, Gold plating, Gold Finger, Carbon Ink, Peelable mask |
Copper foil thickness | 18um-280um(0.5OZ-8OZ)(normally 1OZ) |
Solder mask color | green/black/white/red/blue/yellow |
Outline Tolerance | ±0.13mm |
Impedance control Tolerance | ±10% |
NPTH Hole Tolerance | ±0.075mm |
PTH Hole Tolerance | ±0.05mm |
Certificate | UL,ISO9001,ISO14001,SGS |
Profiling punching | Routing, V-CUT, Beveling |
Production capability | 720000M2/year |