Customization: | Available |
---|---|
Structure: | Flush Rigid PCB |
Dielectric: | FR-4 |
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Item |
Speci. |
Layers |
1~20 |
Board Thickness |
0.1mm-8.0mm |
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc |
Max Panel Size |
600mm×1200mm |
Min Hole Size |
0.1mm |
Min Line Width/Space |
3mil(0.075mm) |
Board Outline Tolerance |
+/-0.10mm |
Insulation Layer Thickness |
0.075mm--5.00mm |
Out Layer Copper Thickness |
18um--350um |
Drilling Hole (Mechanical) |
17um--175um |
Finish Hole (Mechanical) |
0.10mm--6.30mm |
Diameter Tolerance (Mechanical) |
0.05mm |
Registration (Mechanical) |
0.075mm |
Aspect Ratio |
16:1 |
Solder Mask Type |
LPI |
SMT Mini. Solder Mask Width |
0.075mm |
Mini. Solder Mask Clearance |
0.05mm |
Plug Hole Diameter |
0.25mm--0.60mm |
Impedance Control Tolerance |
+/-10% |
Surface finish |
ENIG, OSP, HASL, Chem. Tin/Sn, Flash Gold |
Soldermask |
Green/Yellow/Black/White/Red/Blue |
Silkscreen |
Red/Yellow/Black/White |
Certificate |
UL, ISO 9001, ISO14001, IATF16949 |
Special Request |
Blind hole, Gold finger, BGA, Carbon ink, peekable mask, VIP process, Edge plating, Half holes |
Material Suppliers |
Shengyi, ITEQ, Taiyo, etc. |
Common Package |
Vacuum+Carton |
Production capacity of hot-sale products | |
Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
Technical Capability | Technical Capability |
Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Aluminum base, Copper base |
Layer: 1 layer to 20 Layers | Layer: 1 layer and 2 Layers |
Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
Min.Hole size: 0.1mm(dirilling hole) | Min.Hole size: 12mil(0.3mm) |
Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, etc |
Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
Where does the resin material come from in ABIS?
Most of them are from Shengyi Technology Co., Ltd. (SYTECH), which has been the world's second-largest CCL manufacturer in terms of sales volume, from 2013 to 2017. We established long-term relations of cooperation in 2006. The FR4 resin material (Model S1000-2, S1141, S1165, S1600) is mainly used for making single and double-sided printed circuit boards as well as multi-layer boards. Here comes the details for your reference.
Category | Quickest Lead Time | Normal Lead Time |
Double-sided | 24hrs | 120hrs |
4 Layers | 48hrs | 172hrs |
6 Layers | 72hrs | 192hrs |
8 Layers | 96hrs | 212hrs |
10 Layers | 120hrs | 268hrs |
12 Layers | 120hrs | 280hrs |
14 Layers | 144hrs | 292hrs |
16-20 Layers | Depends on the specific requirements | |
Above 20 Layers | Depends on the specific requirements |