Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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1 | SMT assembly including BGA assembly |
2 | Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP |
3 | Component height: 0.2-25mm |
4 | Min packing: 0204 |
5 | Min distance among BGA : 0.25-2.0mm |
6 | Min BGA size: 0.1-0.63mm |
7 | Min QFP space: 0.35mm |
8 | Min assembly size: (X*Y): 50*30mm |
9 | Max assembly size: (X*Y): 350*550mm |
10 | Pick-placement precision: ±0.01mm |
11 | Placement capability: 0805, 0603, 0402 |
12 | High pin count press fit available |
13 | SMT capacity per day: 80,000 points |
Lines | 9(5 Yamaha,4KME) |
Capacity | 52 million placements per month |
Max Board Size | 457*356mm.(18"X14") |
Min Component size | 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP |
Speed | 0.15 sec/chip,0.7 sec/QFP |
Lines | 2 |
Max board width | 400 mm |
Type | Dual wave |
Pbs status | Lead-free line support |
Max temp | 399 degree C |
Spray flux | add-on |
Pre-heat | 3 |
Production Processes
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
Our Advantages
We provide a comprehensive turn-key EMS service to customers who want us to assemble the PCB into PCBA, including prototypes, NPI projects, and small and medium volumes. We are also able to source all components for your PCB assembly project. Our engineers and sourcing team have rich experience in the supply chain and EMS industry, with deep knowledge in SMT assembly allowing us to resolve all the production issues. Our service is cost-effective, flexible, and reliable. We have satisfied customers across many industries including medical, industrial, automotive, and consumer electronics.
Quality Control
-Advanced equipment LIST
AOI Testing |
Checks for solder paste Checks for components down to 0201 Checks for missing components, offset, incorrect parts, polarity |
X-Ray Inspection |
X-Ray provides high-resolution inspection of: BGAs/Micro BGAs/Chip scale packages /Bare boards |
In-Circuit Testing | In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. |
Power-up Test |
Advanced Function Test
Flash Device Programming
Functional testing
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-Persue 0% complaints on the quality
Production capacity of hot-sale products | |
Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
Technical Capability | Technical Capability |
Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Aluminum base, Copper base |
Layer: 1 layer to 32 Layers | Layer: 1 layer and 2 Layers |
Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
Min.Hole size: 0.1mm(dirilling hole) | Min. Hole size: 12mil(0.3mm) |
Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etc |
Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
Q/T Lead Time
Category | Q/T Lead time | Standard Lead Time | Mass Production | |||
2 Layers | 24hrs | 3-4 working days | 8-15 working days | |||
4 Layers | 48hrs | 3-5 working days | 10-15 working days | |||
6 Layers | 72hrs | 3-6 working days | 10-15 working days | |||
8 Layers | 96hrs | 3-7 working days | 14-18 working days | |||
10 Layers | 120hrs | 3-8 working days | 14-18 working days | |||
12 Layers | 120hrs | 3-9 working days | 20-26 working days | |||
14 Layers | 144hrs | 3-10 working days | 20-26 working days |
ABIS CIRCUITS Company is not only trying to give customers a good product but also paying attention to offering a complete and safe package. Also, we prepare some personalized services for all the orders.
-Common packaging:
-Delivery Tips:
Business Terms
-Accepted Delivery Terms
FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF
--Accepted Payment Currency
USD, EUR, CNY.
-Accepted Payment Type
T/T, PayPal, Western Union.
Quotation from ABIS
To ensure an accurate quote, be sure to include the following information for your project:
FAQ
Q1:When can I get the quotation?