Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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Item | Production Capacity |
Layer Counts | 1-20 layers |
Material | FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. |
Board thickness | 0.20mm-8.00mm |
Maximum Size | 600mmX1200mm |
Board Outline Tolerance | +0.10mm |
Thickness Tolerance(t≥0.8mm) | ±8% |
Thickness Tolerance(t<0.8mm) | ±10% |
Insulation Layer Thickness | 0.075mm--5.00mm |
Minimum Line | 0.075mm |
Minimum Space | 0.075mm |
Out Layer Copper Thickness | 18um--350um |
Inner Layer Copper Thickness | 17um--175um |
Drilling Hole(Mechanical) | 0.15mm--6.35mm |
Finish Hole(Mechanical) | 0.10mm-6.30mm |
Diameter Tolerance(Mechanical) | 0.05mm |
Registration(Mechanical) | 0.075mm |
Aspect Ratio | 16:1 |
Solder Mask Type | LPI |
SMT Mini.Solder Mask Width | 0.075mm |
Mini. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
Impedance control Tolerance | ±10% |
Surface finish/treatment | HASL,ENIG,Chem,Tin,Flash Gold, OSP, Gold Finger |
Production capacity of hot-sale products | |
Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
Technical Capability | Technical Capability |
Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Aluminum base, Copper base |
Layer: 1 layer to 20 Layers | Layer: 1 layer and 2 Layers |
Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
Min.Hole size: 0.1mm(dirilling hole) | Min.Hole size: 12mil(0.3mm) |
Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etc |
Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
Category | Quickest Lead Time | Normal Lead Time |
Double sideds | 24hrs | 120hrs |
4 Layers | 48hrs | 172hrs |
6 Layers | 72hrs | 192hrs |
8 Layers | 96hrs | 212hrs |
10 Layers | 120hrs | 268hrs |
12 Layers | 120hrs | 280hrs |
14 Layers | 144hrs | 292hrs |
16-20 Layers | Depends on the specific requirements | |
Above 20 Layers | Depends on the specific requirements |