Customization: | Available |
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Metal Coating: | Copper |
Mode of Production: | SMT |
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1 | SMT assembly including BGA assembly |
2 | Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP |
3 | Component height: 0.2-25mm |
4 | Min packing: 0204 |
5 | Min distance among BGA : 0.25-2.0mm |
6 | Min BGA size: 0.1-0.63mm |
7 | Min QFP space: 0.35mm |
8 | Min assembly size: (X*Y): 50*30mm |
9 | Max assembly size: (X*Y): 350*550mm |
10 | Pick-placement precision: ±0.01mm |
11 | Placement capability: 0805, 0603, 0402 |
12 | High pin count press fit available |
13 | SMT capacity per day: 80,000 points |
Lines | 9(5 Yamaha,4KME) |
Capacity | 52 million placements per month |
Max Board Size | 457*356mm.(18"X14") |
Min Component size | 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP |
Speed | 0.15 sec/chip,0.7 sec/QFP |
Lines | 2 |
Max board width | 400 mm |
Type | Dual wave |
Pbs status | Lead-free line support |
Max temp | 399 degree C |
Spray flux | add-on |
Pre-heat | 3 |
Production capacity of hot-sale products | |
Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
Technical Capability | Technical Capability |
Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Alurminum base, Copper base |
Layer: 1 layer to 20 Layers | Layer: 1 layer and 2 Layers |
Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
Min.Hole size: 0.1mm(dirilling hole) | Min.Hole size: 12mil(0.3mm) |
Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etc |
Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
Category | Quickest Lead Time | Normal Lead Time |
Double sideds | 24hrs | 120hrs |
4 Layers | 48hrs | 172hrs |
6 Layers | 72hrs | 192hrs |
8 Layers | 96hrs | 212hrs |
10 Layers | 120hrs | 268hrs |
12 Layers | 120hrs | 280hrs |
14 Layers | 144hrs | 292hrs |
16-20 Layers | Depends on the specific requirements | |
Above 20 Layers | Depends on the specific requirements |